EMI/RFI defends the electromagnetic wave / the radio frequency interferes the technological technological process
number ---Technological process ---Chemical name --- Time --- Temperature 1 Melt thickly in advanceJS ETCH 910 3-5Minute Room temperature 2 Water-wash 3 Water-wash 4 Melt thickly JS Wetter 920 5-10Minute 60-65℃ 5 Water-wash 6 Water-wash 7 Neutralization JS Neut 935 3-5Minute60-65℃ 8 Water-wash 9 Water-wash 10 The surface adjustingJS PC-9626 5-12Minute 50-80℃ 11 Water-wash 12 Water-wash 13 Water-wash 14Activate in advance JS Act PP-950D 1-2Minute 20-35℃ 15Activate JS Act PP-950 2-6Minute 21-31℃ 16 Water-wash 17 Water-wash 18 AcceleratorJS Accelerate 960 2-10Minute18-24℃ 19 Water-wash 20 Water-wash 21 Chemical copper facingJS CU-9190 15-30Minute24-30℃ 22 Water-wash 23 Water-wash 24 Pd activatorJS PD-633 3-6Minute 25-32℃ 25 Water-wash 26 Water-wash 27Plate the nickel in chemistryJS-926 3-10Minute60-70℃ 28 Water-wash 29 Water-wash 30 The passivation is dealt with 31 Water-wash 32 Water-wash 33 The pure water washing 34 Stoving
p JS ETCH 910
PC +ABS melts thickly in advance, prevents leaking and moulding
p JS Wetter 920
Thick to take cleaner is even , easy to wash, prevent leaking and moulding.
p JS Neut 935
Neutralizer, prevent leaking and moulding, lengthen colloid Pd service life
The plastics are electroplated and washed and adjust the pharmaceutical
p JS Act PP-950
The Pd of the colloid, steady , longe-lived, the content of liquid Pd of job is low (≤ 50ppm ).
p JS Act-960
Accelerator, improve and plate one layer of cohesion , careful degree
p JS CU-9190
Plate layers of careful , even electric conduction, kind to cover ability
p JS PD-633
Plate the Pd activator before the nickel in copper surface chemistry
The plastics electroplate the special-purpose chemical nickel, add supplementarily at the same time according to the standard, the stability is good, fast to deposit speed, level and smooth appearance have , high adhesive force have.